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Kester "245" No-Clean
Cored Soldering Wire

  • Highly reliable post-soldering residue
  • Minimal residue
  • Compatible with leaded and lead-free alloys
  • Classified as ROL0 per J-STD-004
  • Compliant to Bellcore GR-78

Kester Solder Shown

Product Information
Datasheet 37 KB
MSDS 55 KB
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Kester “245” Low Residue Flux for cored solder wire was developed to complement the newer generations of Low Residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of “245” Low Residue Flux results in visually acceptable assemblies without cleaning, yet soldering quality and efficiency is comparable to that obtained with mildly activated rosin flux. Kester “245” Low Residue Flux is classified as Type ROL0 flux under IPC ANSI/J-STD-004 Joint Industry Standard. This flux was formerly classified as Type LR per MIL-F-14256.

 Kester 245 is available in a wide variety of alloys, wire diameters and flux percentages. For most applications, Sn63Pb37 is used. Consult the alloy temperature chart in Kester’s product catalog for a comprehensive alloy list. The standard wire diameter for most applications is 1.00mm (0.031in). Wire diameters range from0.25 - 6.00mm (0.010 to 0.250in).

A "Standard Wire Diameters" chart also is also included in Kester’s product catalog. The amount of flux in the wire dictates the ease of soldering for an application. For tin/lead applications, core 50 or 58 (1.1 and 2.2% flux by weight) are recommended. Kester 245 is packaged on spools of different sizes to accommodate a variety of applications.

 

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2471508800  Kester 24-7150-8800 245 No Clean Wire, Solder; 62/36/2 Alloy; 0.031 in.; Flux-Cored Solder Wire; 1 lbs.  Buy Now $63.26
 
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